Henkel Loctite® ABLESTIK JM 7000 Adhesive

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Henkel Loctite® ABLESTIK JM 7000 Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: Excellent adhesion Low moisture in cavity Low weight loss during cure Low ionic impurities High reliability Minimal voiding Electrically conductive Thermally conductive Application: Die attach Filler Type: Silver Substrates Alumina, Gold plated alumina and Heat Sinks Typical Package Application: VLSI packages, Solder sealed ceramic packages and Solder sealed hermetic packaging LOCTITE ABLESTIK JM 7000 die attach adhesive has been formulated for use in high throughput die attach applications. This material has been used successfully on rigid substrates with die sizes up to 700 mils. LOCTITE ABLESTIK JM 7000 has been approved by DESC and Rome Laboratory for military products. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Viscosity	9000 cP @Shear Rate 22.0 1/s	HAAKE RV-20 Rotoviscometer, Cone 1º

Mechanical Properties	Original Value	Comments
Tensile Modulus	10000 MPa	DMTA, Cured 30 minutes @ 300ºC
Shear Strength	>= 17.0 MPa	cured 30 minutes @ 300ºC
	>= 17.0 MPa	cured 30 minutes @ 300ºC, After 1000 TC'C"

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.010 ohm-cm	Sample cured 30 minutes @ 300ºC

Thermal Properties	Original Value	Comments
CTE, linear	33.0 µm/m-°C	Cured, Below Tg
Thermal Conductivity	1.00 W/m-K @Temperature 90.0 °C	Cured, Bulk
	1.00 W/m-K @Temperature 165 °C	Cured, Bulk
Glass Transition Temp, Tg	240 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min @Temperature 150 °C
Working Life	8.00 - 16.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<15	Cured, Sodium (Na+)
	<15	Cured, Potassium (K+)
Shear Strength	>5 kg-f	Die, 2 X 2 mm Si die, cured 20 minutes @ 150ºC

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PLOCT5057 / 255268

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