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Master Bond adhesives

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Henkel Loctite® 3517M Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Product Benefits:

  • One component
  • Reworkable
  • Low halogen content
Cure Heat cure

Application: Underfill

Typical Package Application: CSP, Flip Chip BGA and BGA

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.12 g/ccUncured
Density 1.15 g/ccUncured
Water Absorption 0.10 %
@Time 86400 sec
Cured; ISO 62
Viscosity 2600 cPUncured, Shear rate of 36 s-1, HAAKE PK1.2
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 87Cured
Flexural Strength 120 MPaCured; ASTM D790
Flexural Modulus 3500 MPaCured; ASTM D790
Shear Strength 14.4 MPaCured, Lap, Epoxy glass; ISO 4587
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.80e+16 ohm-cmCured; IEC 60093
Surface Resistance 2.50e+16 ohmCured; IEC 60093
Dielectric Constant 3.06
@Frequency 1e+7 Hz
Cured; IEC 60250
 3.1
@Frequency 1e+6 Hz
Cured; IEC 60250
 3.13
@Frequency 100000 Hz
Cured; IEC 60250
Dissipation Factor 0.010
@Frequency 100000 Hz
Cured; IEC 60250
 0.010
@Frequency 1e+6 Hz
Cured; IEC 60250
 0.020
@Frequency 1e+7 Hz
Cured; IEC 60250
 
Thermal PropertiesOriginal ValueComments
CTE, linear 65.0 µm/m-°CCured, Below Tg
 191 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg 78.0 °CCured, (Tg) by TMA
 101 °CCured, (Tg) by DMTA
Shrinkage 1.4 %Cured
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 120 °C
 10.0 min
@Temperature 100 °C
 
Descriptive Properties
Flow Rate1 min 3 s50 °C, 0.1 mm gap, Glass to Glass, 12.7 mm flow
 4 min 56 s25 °C, 0.15 mm gap, Glass to Glass, 12.7 mm flow
 53 s50 °C, 0.15 mm gap, Glass to Glass, 12.7 mm flow
 8 min 49 s25 °C, 0.1 mm gap, Glass to Glass, 12.7 mm flow
Pot Life7 daysUncured

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PLOCT5000 / 255211

Rulon Bearings

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