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Master Bond adhesives

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Henkel Loctite® ECCOBOND UF 1173 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Heat cure

Product Benefits:

  • One component
  • Void-free underfill
  • Low CTE
  • Long pot life
  • Dissipates stress away from solder joints
Application: 2nd Level Underfill

LOCTITE ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.

Information provided by Loctite®

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Physical PropertiesOriginal ValueComments
Density 1.69 g/cc
Viscosity 7500 cP
@Shear Rate 10.0 1/s
Uncured, Rheometer AR 1000
Outgassing - Total Mass Loss 0.020 %CVCM, NASA Outgassing
 0.10 %WVR, NASA Outgassing
 0.43 %TML, NASA Outgassing
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 6000 MPaStorage, Cured, DMA
 
Thermal PropertiesOriginal ValueComments
CTE, linear 26.0 µm/m-°CCured, Below Tg
 103 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg 160 °CCured, by TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 150 °C
Shelf Life 6.00 Month
@Temperature -40.0 °C
 
Descriptive Properties
Pot Life48 hrs
Thixotropic Index0.71Uncured

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PLOCT5088 / 255299

Rulon Bearings

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