Appearance: Silver Product Benefits: - Thin, uniform bondline control
- Provides RF/EMI shielding
- Electrically conductive in x, y, z axes
- Excellent electrical and thermal conductivity
- Passes NASA outgassing
Cure: Heat cureApplication: Die attach Typical Package Application: Microwave circuitry and Heat sink attach LOCTITE ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Information provided by Loctite® |