Syensqo (Solvay Specialty Polymers) KetaSpire® NT1 HC AM Filament PEEK

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Syensqo (Solvay Specialty Polymers) KetaSpire® NT1 HC AM Filament PEEK
Categories:	Polymer; 3D Printing/Additive Manufacturing Polymer; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)
Material Notes:	Ketaspire® NT1 HC AM Filament provides long-term performance up to 240 °C, including exceptional chemical resistance, outstanding wear and abrasion resistance offered for use in high-performance healthcare applications. These properties make it particularly suited for metal replacement. Applications: Medical Devices; Medical/Healthcare Applications Features: Biocompatible; Chemical Resistant; Ductile; Flame Retardant; Good Dimensional Stability; Good Impact Resistance; High Heat Resistance Printing conditions for data table: - Filament drying conditions, minimum 4h: 150°C - Extruder temperature: 400-440°C - Bed temperature: 180-220°C - Printing tool path: cross hatching in the XY plane Test specimen parameters: - First layer: 0.3mm thick - Subsequent layers: 0.1mm - 100% infill - 3 shells - Printing speed: 18 mm/s Information provided by Solvay Specialty Polymers.
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Physical Properties	Metric	English	Comments

Density	1.29 g/cc	0.0466 lb/in³	ASTM D792

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	48.0 MPa	6960 psi	ASTM D638
Tensile Strength, Yield	85.0 MPa	12300 psi	ASTM D638
Elongation at Break	26 %	26 %	ASTM D638
Elongation at Yield	4.8 %	4.8 %	ASTM D638
Tensile Modulus	3.12 GPa	453 ksi	ASTM D638
Izod Impact, Notched	0.810 J/cm	1.52 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
Melting Point	343 °C	649 °F

Descriptive Properties
Availability	Asia Pacific
	Europe
	Latin America
	North America
Color	Natural Color
Diameter	1.75 mm
Forms	Filament
Processing	3D Printing, Fused Filament Fabrication (FFF)

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PSOL8Y4350 / 280150

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