| 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C. TIGA 901 is an electrically conductive, silver filled epoxy adhesive recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. This two-part smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. TIGA 901 cures at room temperature and can be used as a “cold-solder” for heat sensitive components where hot soldering is impractical. Applications: This product can be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields. Information provided by Resin Technology Group. |
