Henkel Loctite® ABLESTIK 8200C Adhesive

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Henkel Loctite® ABLESTIK 8200C Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Product Benefits: High electrical conductivity Improved MRT on Ag plated LF Low bleed Snap curable Cure: Heat cure Application: Die attach Filler Type: Silver Key Substrates: PPF, Copper and Silver LOCTITE ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.200 %	Saturation, after 85% RH exposure
Brookfield Viscosity	11500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	759 MPa @Temperature 250 °C	Cured, DMTA
	1172 MPa @Temperature 150 °C	Cured, DMTA
	4621 MPa @Temperature 25.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00017 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	60.0 µm/m-°C	Cured, Below Tg
	130 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.20 W/m-K	Cured
Glass Transition Temp, Tg	190 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175°C + 15 minutes @ 175°C
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	19.1 kg-f	Die, x 3 mm Si die on SPCLF
Thixotropic Index	5	Uncured, 0.5/5 rpm
Weight Loss (%)	1	Cure, 300ºC

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PLOCT5026 / 255237

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