Henkel Loctite® ABLESTIK 2033SC Adhesive

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Henkel Loctite® ABLESTIK 2033SC Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Red Product Benefits: Non-conductive Single component Low bleed Long work life Low cure temperature Fast cure Optimized rheology Cure: Heat cure Application: Die attach LOCTITE ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. Information provided by Loctite®
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Physical Properties	Original Value	Comments

pH	3.6
Brookfield Viscosity	11300 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	30.0 MPa @Temperature 150 °C	Cured, DMTA
	60.0 MPa @Temperature 200 °C	Cured, DMTA
	2100 MPa @Temperature 25.0 °C	Cured, DMTA
	4200 MPa @Temperature -65.0 °C	Cured, DMTA
Shear Strength	20.0 MPa	3 X 3 mm, Si die, Substrate: PBGA-FR4

Thermal Properties	Original Value	Comments
CTE, linear	56.0 µm/m-°C	Cured, Below Tg
	133 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	46.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	0.167 min @Temperature 150 °C	Alternative Cure Schedule 2
	1.00 min @Temperature 120 °C	Alternative Cure Schedule 1
	1.50 min @Temperature 110 °C
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<15	Cured, Sodium (Na+)
	<30	Cured, Chloride (Cl-)
	<5	Cured, Potassium (K+)
Thixotropic Index	6.1	Uncured, 0.5/5 rpm
Water Extract Conductivity	<130 µmhos/cm	Cured
Weight Loss (%)	0.5	Cure, 10 x 10 mm Si die on glass slide

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PLOCT5014 / 255225

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