Henkel Loctite® ECCOBOND FP4460 Epoxy

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Henkel Loctite® ECCOBOND FP4460 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat Cure Product Benefits: High purity Low stress Improved work life High temperature performance Excellent chemical resistance Excellent moisture resistance High flow Application: Encapsulant - glob top Filler Type: Silica Typical Package Application: Automotive applications, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules, BGA and Pin grid arrays LOCTITE ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.78 g/cc
Filler Content	75 %
Brookfield Viscosity	300000 cP	Spindle 7, speed 10 rpm
	425000 cP	Spindle 7, speed 4 rpm

Thermal Properties	Original Value	Comments
CTE, linear	20.0 µm/m-°C	Cured, Below Tg
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-65.0 °C
Glass Transition Temp, Tg	173 °C	Cured, by TMA
Shrinkage	0.135 %	Cured

Processing Properties	Original Value	Comments
Cure Time	3.00 hour @Temperature 150 °C
Gel Time	10.0 min @Temperature 121 °C
Shelf Life	9.00 Month @Temperature -40.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	11	Cured, Sodium (Na+)
	13	Cured, Chloride (Cl-)
	2	Cured, Potassium (K+)
Pot Life	2 days	time to double viscosity

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PLOCT5080 / 255291

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