MP54270 is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures quickly at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release. It has very good resistance to water, acids and bases and most organic solvents. It was formulated to a 1A:1B volume mix ratio for use in side-by-side cartridges and meter/mix dispensing equipment. MP54270 will reach full cure at room temperature within 24 hours.Information provided by Adhesive Systems, Inc. |