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Ensinger PEI

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ASI® MP 54270 Epoxy Adhesive
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: MP54270 is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures quickly at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release. It has very good resistance to water, acids and bases and most organic solvents. It was formulated to a 1A:1B volume mix ratio for use in side-by-side cartridges and meter/mix dispensing equipment. MP54270 will reach full cure at room temperature within 24 hours.

Information provided by Adhesive Systems, Inc.

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.970 g/cc
@Temperature 25.0 °C
part B
 1.10 g/cc
@Temperature 25.0 °C
mixed
 1.16 g/cc
@Temperature 25.0 °C
part A
Viscosity 8000 cPpart B
 10000 cPmixed
 12000 cPpart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80
Tensile Strength 7500 psi
Elongation at Break >= 4.0 %
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 8.30e+14 ohm-cm
Dielectric Constant 3.5
@Frequency 100 Hz,
Temperature 25.0 °C
Dielectric Strength 410 V/mil
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -40.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 65.0 °C
 24.0 - 72.0 hour
@Temperature 25.0 °C
Pot Life 20.0 - 30.0 min50 grams
Shelf Life 12.0 MonthIn unopened container
 
Descriptive Properties
Color / appearanceclear
Mix Ratio1:1 by volume
 100:85 by weight

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PASINC9091 / 233458

Proto3000 – 3D Engineering Solutions

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