Appearance: Silver Cure: Heat Cure Product Benefits: - Long work life
- Good workability
- Syringe dispensable
- Stencil printable
- High electrical conductivity
- High thermal conductivity
- High die shear strength
Application: High power die attach Typical Package Application: High thermal package applications Key Substrates: Metalized back side die to Ag or Au coated substrates or other metalized leadframes LOCTITE ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC. Information provided by Loctite® |