Henkel Loctite® ABLESTIK QMI536HT Paste

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Henkel Loctite® ABLESTIK QMI536HT Paste
Categories:	Polymer
Material Notes:	Appearance: Pink Filler Type: Boron Nitride Cure: Skip-Cure Process or Heat Cure Product Benefits: Electrically non-conductive Hydrophobic Stable at high temperatures Void-free bondline Excellent interfacial adhesion strength Good resistance to "popcorning" after exposure to reflow temperatures Excellent dielectric properties Application: Die attach Typical Package Application: PBGA, Array packages, Tape packs and CSP Typical Applications: Heat sinks, Heat slugs and Flip Chip Surface Finishes: Solder Mask, BT, FR, Au, Silicon, Polyimide, Kapton™, Palladium, Alloy 42 and Mylar™ LOCTITE ABLESTIK QMI536HT die attach paste was designed to attach integrated circuits and components to advanced substrates. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.25 g/cc
Moisture Absorption	<= 0.350 % @Temperature 85.0 °C	168 hrs, 85% RH
Brookfield Viscosity	13000 cP	Uncured, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	850 MPa	Cured

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	Cured
Dielectric Constant	3.4 @Frequency 1e+6 Hz	Cured

Thermal Properties	Original Value	Comments
CTE, linear	66.0 µm/m-°C	Cured, Below Tg
	177 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.900 W/m-K	Cured
Glass Transition Temp, Tg	4.00 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	>= 0.130 min @Temperature 150 °C	Skip Cure Process, at bondline
	>= 0.167 min @Temperature 150 °C	Snap Cure Schedule, at bondline
	>= 0.167 min @Temperature 150 °C	Tunnel Oven configured with hot gas or IR, at bondline
	15.0 min @Temperature 150 °C	Conventional Oven, at bondline
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Sodium (Na+)
	<20	Cured, Potassium (K+)
	<20	Cured, Chloride (Cl-)
	<20	Cured, Fluoride (F-)
Pot Life	24 hrs
Shear Strength	17 kg-f	Die, 0.635 x 0.635 mm, 0.254 mm BLT
Thixotropic Index	5.5	Uncured, 0.5/5 rpm

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PLOCT5063 / 255274

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