Henkel Loctite® ECCOBOND UF 3810 Epoxy

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Henkel Loctite® ECCOBOND UF 3810 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Black liquid Cure: Heat cure Product Benefits: One component Fast cure at moderate temperatures High Tg Halogen free Compatible with most Pb-free solders Stable electrical performance in temperature humidity bias Reworkable Room temperature flow capability Typical Package Application: Chip scale packages and BGA LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.13 g/cc

Mechanical Properties	Original Value	Comments
Tensile Modulus	30.0 MPa @Temperature 200 °C	Storage, Cured, DMA
	850 MPa @Temperature 100 °C	Storage, Cured, DMA
	2990 MPa @Temperature 25.0 °C	Storage, Cured, DMA
	3820 MPa @Temperature -65.0 °C	Storage, Cured, DMA
Shear Strength	9.70 MPa	Lap, Glass Epoxy to Glass Epoxy; ISO 4587

Electrical Properties	Original Value	Comments
Dielectric Constant	2.87 @Frequency 2.00e+9 Hz
	3.44 @Frequency 1e+9 Hz
Dissipation Factor	0.0037 @Frequency 2.00e+9 Hz
	0.0071 @Frequency 1e+9 Hz

Thermal Properties	Original Value	Comments
CTE, linear	55.0 µm/m-°C	Cured, Below Tg
	171 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.290 W/m-K	Laser Flash
Glass Transition Temp, Tg	102 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	>= 8.00 min @Temperature 130 °C
Working Life	72.0 hour	Worklife, 25% increase in viscosity
Shelf Life	12.0 Month @Temperature -20.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	0.7	Cured, Sodium (Na+), DI water, 1 hour @ 85 °C
	0.7	Cured, Ammonium (NH4+), DI water, 1 hour @ 85 °C
	0.8	Cured, Chloride (Cl-), DI water, 1 hour @ 85 °C
	5	Cured, Calcium (Ca²+), DI water, 1 hour @ 85 °C
	ND	Cured, Potassium (K+), DI water, 1 hour @ 85 °C
	ND	Cured, Magnesium (Mg2+), DI water, 1 hour @ 85 °C
	ND	Cured, Nitrate (NO3), DI water, 1 hour @ 85 °C
	ND	Cured, Phosphite (PO3), DI water, 1 hour @ 85 °C
	ND	Cured, Sulfate (SO4 2-), DI water, 1 hour @ 85 °C
	ND	Cured, Bromide (Br-), DI water, 1 hour @ 85 °C

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PLOCT5089 / 255300

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