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Lord Adhesives Thermoset™ SC-300M Silicone Gel Encapsulant
Categories: Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade

Material Notes: SC-300M is a two-part, rapid curing, platinum-catalyzed, addition cured, silicone gel. It has an extremely soft, gel-like consistency when cured, and has excellent unprimed adhesion to most substrates. SC-300M provides thermal, mechanical, and vibration dampening, and has excellent electrical properties.

SC-300M does not generate an exotherm during cure and it is resistant to reversion. It exhibits very low shrinkage and the cure may be accelerated by the application of heat. SC-300M has excellent heat stability and relatively low toxicity.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.990 g/ccSTM 2
Volatiles 0.010 %
Viscosity 200 cPSTM 1
 
Mechanical PropertiesOriginal ValueComments
Penetration 5.0
@Load 0.0195 kg
mm
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 9.90e+14 ohm-cm
@Temperature 25.0 °C
ASTM D257
Dielectric Constant 2.7
@Frequency 100000 Hz,
Temperature 25.0 °C
ASTM D150
Dissipation Factor 0.0050
@Frequency 100000 Hz,
Temperature 25.0 °C
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 326 µm/m-°C
@Temperature 25.0 °C
Thermal Conductivity 0.154 W/m-KASTM D2214
Maximum Service Temperature, Air 200 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Temperature 25.0 °C
Pot Life 30 min
@Temperature 25.0 °C
Gel Time 50.0 min
@Temperature 25.0 °C
Shelf Life 6.00 Month
@Temperature 25.0 °C
 
Descriptive Properties
Mix Ratio1:1by weight, by volume

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PLORD064 / 86072

Specialty Compounds RTP Company

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