Henkel Loctite® ABLESTIK 71-1 Polyimide

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Henkel Loctite® ABLESTIK 71-1 Polyimide
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	Appearance: Silver Product Benefits: Electrically conductive High purity Cure Heat: cure Application: Die attach Filler Type: Silver LOCTITE ABLESTIK 71-1 die attach adhesive is designed for microelectronic and semiconductor packaging applications. It is formulated to provide high bond strength at ambient and elevated temperatures. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.600 % @Temperature 85.0 °C	Cured @ Saturation, after 85% RH exposure
pH	6.7
Brookfield Viscosity	14000 cP	Uncured, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	2300 MPa @Temperature 250 °C	Cured
	3000 MPa @Temperature 150 °C	Cured
	3400 MPa @Temperature 25.0 °C	Cured
	3600 MPa @Temperature -65.0 °C	Cured
Shear Strength	7.00 MPa	Die, Al to Al

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00013 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	41.0 µm/m-°C	Cured, Below Tg
Thermal Conductivity	2.00 W/m-K @Temperature 121 °C	Cured, C-matic Conductance Tester
Glass Transition Temp, Tg	240 °C	Cured, TMA penetration mode

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 150°C + 30 minutes @ 275°C
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	5	Cured, Chloride (Cl-)
	5	Cured, Sodium (Na+)
	5	Cured, Potassium (K+)
Shear Strength	3.8 kg-f/die	Lap, 2 X 2 mm (80 x 80 mil) Si die on Ag/Cu LF
Thixotropic Index	2.9	Uncured, 0.5/5 rpm
Water Extract Conductivity	15 µmhos/cm	Cured
Weight Loss (%)	0.35	Cured @ 300ºC, TGA

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PLOCT5001 / 255212

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