Henkel Loctite® ABLESTIK 2100A Adhesive

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Henkel Loctite® ABLESTIK 2100A Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: High hot/wet adhesion Low stress Ultra-low moisture absorption Pb-free applications Excellent dispensing characteristics Low bleed Fast cure capability Application: Die attach Filler Type: Silver Substrates: PBGA and BGA LOCTITE ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.270 % @Temperature 85.0 °C	Cured, 168 hours @ 85% RH
Brookfield Viscosity	9000 cP	Spindle 51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	152 MPa @Temperature 200 °C
	172 MPa @Temperature 150 °C
	234 MPa @Temperature 250 °C
	1517 MPa @Temperature 25.0 °C
	3172 MPa @Temperature -65.0 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	0.050 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	65.0 µm/m-°C	Cured, Below Tg
	200 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.20 W/m-K @Temperature 121 °C	Cured
Maximum Service Temperature, Air	260 °C
Glass Transition Temp, Tg	60.0 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175°C + 15 minutes @ 175°C
Working Life	>= 24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	16 kg-f	Die, 2 X 2 mm, 3 X 3 mm, Si die, PBGA solder mask @25°C
	3.5 kg-f	Hot/Wet Die, 3 X 3 mm, Si die, After 85°C/85%RH exposure for 48 hours, PBGA solder mask @250°C
	3.6 kg-f	Die, 2 X 2 mm, 3 X 3 mm, Si die, PBGA solder mask @250°C
	5 kg-f	Die, 2 X 2 mm, 3 X 3 mm, Si die, PBGA solder mask @200°C
	9.5 kg-f	Die, 2 X 2 mm, Si die on Ag/Cu leadframe
Thixotropic Index	5.3	Uncured, 0.5/5 rpm
Weight Loss (%)	1.3	10 x 10 mm Si die on glass slide

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PLOCT5113 / 255324

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