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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® 920 Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low outgassing epoxy.

Information Provided by Epoxy Technology

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.02 g/cc1.02 g/ccPart B
 2.24 g/cc2.24 g/ccPart A
Particle Size <= 50 µm<= 50 µm
Viscosity 13000 - 20000 cP
@Temperature 23.0 °C
13000 - 20000 cP
@Temperature 73.4 °F
20 rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9090
Tensile Modulus 5.25 GPa762 ksiStorage
Shear Strength >= 13.8 MPa>= 2000 psiLap
 >= 35.2 MPa>= 5100 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cm
Dielectric Constant 5.19
@Frequency 1000 Hz
5.19
@Frequency 1000 Hz
Dissipation Factor 0.0080
@Frequency 1000 Hz
0.0080
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 24.0 µm/m-°C13.3 µin/in-°FBelow Tg
 117 µm/m-°C65.0 µin/in-°FAbove Tg
Thermal Conductivity 0.970 W/m-K6.73 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °FContinuous
 300 °C572 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 90.0 °C>= 194 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 343 °C649 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 min
@Temperature 150 °C
0.0833 hour
@Temperature 302 °F
minimum
 10.0 min
@Temperature 120 °C
0.167 hour
@Temperature 248 °F
minimum
 20.0 min
@Temperature 100 °C
0.333 hour
@Temperature 212 °F
minimum
Pot Life 300 min300 min
Shelf Life 6.00 Month
@Temperature 25.0 °C
6.00 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorAmberPart B
 GreyPart A
ConsistencySmooth Paste
Mix Ratio by Weight100:3
Number of ComponentsTwo
Thixotropic Index2.1
Weight Loss<0.05%200°C
 0.24%250°C
 0.77%300°C

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PPOXYT053 / 141092

Chemically Resistant adhesives

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