Dymax 3092P Fast Shallow Potting Compound and Sealant

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Dymax 3092P Fast Shallow Potting Compound and Sealant
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	Shallow Potting and Sealing in Seconds Features UV cures in seconds to 1/4 inch deep One component, no mixing Solvent-free Environmentally friendly Excellent adhesion to most substrates Description UV curable potting materials are used for sealing electrical connectors, temperature probes and sensors in applications throughout the aerospace, electronic, electrical, industrial, defense and marine industries. Dymax pitting compounds cure in seconds, on demand, and have very low shrinkage. See pages for a selection of Dymax UV curing lamps and conveyors which can lower production costs when used in conjunction with Dymax adhesives. Dymax 3092P Fast Shallow Potting Compound and Sealant Resilient, translucent bonds Key Substrates: Glass, Metal, FR-4, Ceramic Typical Use: Connectors, thermal switches, tamper proofing
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PDYYMAX28 / 35012

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