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Henkel Loctite® 3861 Thermally Conductive Potting
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
Thermally Conductive Bonders and Potters
Loctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or microprocessors and their heat sinks. Loctite offers a wide range of adhesive chemistries including silicones, acrylics and epoxies. Many processing options are available for curing these adhesives such as heat cure, activator cure, and UV light.

Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3861 Thermally Conductive Potting
A thermally conductive, potting compound for automotive electronic applications requiring thermal conductivity and chemical resistance. Resistant to water, gases and petroleum vapors. Cure Type: Heat Bonding Type: 2-part epoxy (100:9.5)

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Physical PropertiesMetricEnglishComments
Viscosity <= 10000 cP<= 10000 cPMixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8585
 
Thermal PropertiesMetricEnglishComments
CTE, linear 28.0 µm/m-°C
@Temperature 20.0 °C
15.6 µin/in-°F
@Temperature 68.0 °F
Glass Transition Temp, Tg 118 °C244 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 120 min2.00 hour130ºC
 240 min4.00 hour100ºC
Pot Life 720 min
@Temperature 23.0 °C
720 min
@Temperature 73.4 °F

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PLOCT199 / 51935

Specialty Compounds RTP Company

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