Goodfellow High Thermal Conductivity Silicon Nitride

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Goodfellow High Thermal Conductivity Silicon Nitride
Categories:	Ceramic; Nitride
Material Notes:	High Thermal Conductivity - much higher than typical silicon nitride. High fracture toughness. Surface roughness of Ra 0.02 µm achievable through polishing. Used in Power module substrates; Various types of heat sinks; LED mounting substrates; High frequency circuit substrates. Information provided by Goodfellow.
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Physical Properties	Metric	English	Comments

Density	3.30 g/cc	0.119 lb/in³

Mechanical Properties	Metric	English	Comments
Tensile Modulus	312 GPa	45300 ksi
Flexural Strength	700 MPa	102000 psi
Poissons Ratio	0.29	0.29
Shear Modulus	121 GPa	17500 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	3.00 µm/m-°C @Temperature 25.0 - 800 °C	1.67 µin/in-°F @Temperature 77.0 - 1470 °F
Thermal Conductivity	100 W/m-K	694 BTU-in/hr-ft²-°F

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CGOODF248m / 197462

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