Parker Chomerics CHO-FLEX 601 Conductive Coating

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Parker Chomerics CHO-FLEX 601 Conductive Coating
Categories:	Polymer; Thermoset; Polyurethane, TS
Material Notes:	CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adhesion and flexibility, thermal stability, high conductivity, and superior peel strength. CHO-FLEX™ 601 coating can be sprayed or silkscreened, and will withstand wave solder temperatures above 500°F (260°C) without losing any of its exceptional properties Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Density	1.67 g/cc	0.0603 lb/in³
Solids Content	58 %	58 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00015 ohm-cm @Thickness 0.0254 mm	0.00015 ohm-cm @Thickness 0.00100 in	film
Surface Resistivity per Square	<= 0.050 ohm @Thickness 0.0254 mm	<= 0.050 ohm @Thickness 0.00100 in	film

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	>= 107 °C	>= 225 °F

Processing Properties	Metric	English	Comments
Cure Time	3.00 min @Temperature 260 °C	0.0500 hour @Temperature 500 °F	Wave Solder
	90.0 min @Temperature 182 °C	1.50 hour @Temperature 360 °F
	300 min @Temperature 163 °C	5.00 hour @Temperature 325 °F	Initial Cure
	5400 min @Temperature 182 °C	90.0 hour @Temperature 360 °F	Press Cycle
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties
Adhesion	5B		ASTM D3359-78
Binder	Polyurethane
Consistency	Thixotropic Paste
Filler	Ag
Resin	Polyurethane
Theoretical Coverage	4320 in² / lb		Actual coverage will be 50-100%

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PCHOME071 / 28293

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