Envalior ForTii® CX33F PPA-GF50 PA4T High Temperature Polyamide

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Envalior ForTii® CX33F PPA-GF50 PA4T High Temperature Polyamide
Categories:	Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 50% Glass Fiber Reinforced
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® CX33F is a high stiffness, low warpage material for metal replacement which is optimized for low friction and good scratch resistance. ForTii CX33F is resistant to a wide range of chemicals and is suitable for demanding industrial applications. Features: Low warpage. Wear and friction modified. 50% glass reinforced. Processing: Injection molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Metric	English	Comments

Density	1.62 g/cc	0.0585 lb/in³	Dry; ISO 1183
Moisture Absorption	1.60 %	1.60 %	Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow	0.0020 cm/cm	0.0020 in/in	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.0070 cm/cm	0.0070 in/in	Dry; ISO 294-4

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	275 MPa	39900 psi	Dry; ISO 527-1/-2
	275 MPa	39900 psi	Cond; ISO 527-1/-2
Elongation at Break	2.7 %	2.7 %	Dry; ISO 527-1/-2
	2.7 %	2.7 %	Cond; ISO 527-1/-2
Tensile Modulus	17.0 GPa	2470 ksi	Dry; ISO 527-1/-2
	17.0 GPa	2470 ksi	Cond; ISO 527-1/-2
Charpy Impact, Notched	1.50 J/cm² @Temperature 23.0 °C	7.14 ft-lb/in² @Temperature 73.4 °F	Dry; ISO 179/1eA

Thermal Properties	Metric	English	Comments
Melting Point	315 °C	599 °F	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	290 °C	554 °F	Dry; ISO 75-1/-2

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PDSM7928 / 291364

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