Emerson & Cuming 276 Eccobond® Two-Component Thermally Conductive Epoxy Adhesive and Sealant Highly filled, high temperature resistant, thermally conductive, epoxy adhesive and sealant. Requires heat cure. Excellent chemical resistance. Used for bonding metal, glass and ceramic substrates. Mix ratio = 100:10 (cat 17 M 1). Cure Type: Heat Bonding Type: Epoxy The Eccobond® product line is now a part of Henkel; this specific grade is discontinued. |