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Ensinger PEI

ITW Insulcast® RTVS 11 Silicone Potting/Encapsulation Compound
Categories: Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade

Material Notes: Insulcast® solutions are compounds designed for potting and encapsulating. RTVS 11 is a low viscosity, multi-purpose compound, designed for use as a potting, encapsulating, sealing and mold making material. Due to its excellent electrical properties, the RTVS 11 is used extensively is a high voltage potting compound, as well as an encapsulating compound for delicatecircuitry. The RTVS 11 can be used with various curing agents, thus varying pot life, cure time, mix ratios and cure conditions.

Information provided by ITW Performance Polymers.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.18 g/cc1.18 g/cc
Viscosity 12000 cP12000 cPASTM D1084
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 4545ASTM D2240
Tensile Strength 3.45 MPa500 psiASTM D412
Elongation at Break 150 %150 %ASTM D412
Tear Strength 3.51 kN/m20.0 pliDie B; ASTM D624
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 9.00e+14 ohm-cm9.00e+14 ohm-cmASTM D257
Dielectric Constant 3.4
@Frequency 1000 Hz
3.4
@Frequency 1000 Hz
ASTM D150
Dielectric Strength 19.7 kV/mm500 kV/inASTM D149
Dissipation Factor 0.020
@Frequency 1000 Hz
0.020
@Frequency 1000 Hz
ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear 250 µm/m-°C139 µin/in-°F
Thermal Conductivity 0.0259 W/m-K0.180 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C399 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
Flammability, UL94 V-0V-0
Shrinkage 0.20 - 0.50 %0.20 - 0.50 %
 
Processing PropertiesMetricEnglishComments
Cure Time 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
USING 0.3% CAT 2 (DBT). Faster tack-free surfaces achieved using varied catalysts.
Pot Life 15.0 - 120 min15.0 - 120 minvaries with % of CAT-2
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
Colorwhite
Mix Ratio by weight0.1 to 0.5%CAT 2

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