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Ensinger PEI

Sumitomo Bakelite North America 3-2-530 Short-Glass Reinforced Diallyl Phthalate
Categories: Polymer; Thermoset; Diallyl Phthalate (DAP); Diallyl Phthalate (DAP) Molding Compound, Short Glass Fiber Filled; Filled/Reinforced Thermoset

Material Notes: Isophthalate DAP Resin Isomer. Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.

Information provided by Sumitomo Bakelite North America, Inc.

Key Words: DAP
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Physical PropertiesMetricEnglishComments
Density 1.76 g/cc0.0636 lb/in³ASTM D792
Apparent Bulk Density 0.500 g/cc0.0181 lb/in³
Water Absorption 0.35 %0.35 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0010 - 0.0040 cm/cm0.0010 - 0.0040 in/inCompression Molding. ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 69.0 MPa10000 psiASTM D638
Flexural Yield Strength 131 MPa19000 psiASTM D790
Flexural Modulus 13.8 GPa2000 ksiASTM D790
Compressive Yield Strength 152 MPa22000 psiASTM D695
Izod Impact, Notched 1.60 J/cm3.00 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant  3.9
@Frequency 1e+6 Hz
3.9
@Frequency 1e+6 Hz
Wet
 4.1
@Frequency 1000 Hz
4.1
@Frequency 1000 Hz
Wet
Dielectric Strength 15.0 kV/mm381 kV/inWet, step-by-step. ASTM D149
 16.0 kV/mm406 kV/inWet, short term. ASTM D149
Dissipation Factor  0.010
@Frequency 1000 Hz
0.010
@Frequency 1000 Hz
Wet; ASTM D150
 0.019
@Frequency 1e+6 Hz
0.019
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 135 sec135 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 15.0 µm/m-°C
@Temperature 20.0 °C
8.33 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Deflection Temperature at 1.8 MPa (264 psi) 288 °C550 °FASTM D648A
Oxygen Index 40 %40 %ASTM D2863
 
Processing PropertiesMetricEnglishComments
Processing Temperature 160 - 180 °C320 - 356 °FMold temperature

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