Emerson & Cuming 285 Eccobond® Two-Component Thermally Conductive Epoxy Adhesive Highly filled, thermally conductive epoxy adhesive. Low shrinkage and coefficient of expansion. Used with a variety of catalysts. Recommended for bonding metal and ceramic substrates in heat sink applications. Many properties vary with catalyst used, and are hence not listed here. Bonding Type: Epoxy The Eccobond® product line is now a part of Henkel; this specific grade is discontinued. |