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Ensinger PEI

Celanese Hostaform® S 9243 XAP2™ LS POM, Impact Modified
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM); Acetal Copolymer, Impact Modified

Material Notes: POM copolymer, modified
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul
The product can then be stored in standard conditions until processed.

Information provided by Celanese Corporation.

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Physical PropertiesMetricEnglishComments
Density 1.33 g/cc0.0480 lb/in³ISO 1183
Water Absorption at Saturation 1.0 %1.0 %ISO 62
Linear Mold Shrinkage, Flow 0.019 cm/cm0.019 in/inISO 294-4
Linear Mold Shrinkage, Transverse 0.018 cm/cm0.018 in/inISO 294-4
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 44.0 MPa6380 psi50mm/min; ISO 527-2/1A
Elongation at Break 40 %40 %50mm/min; ISO 527-2/1A
Elongation at Yield 9.0 %9.0 %50mm/min; ISO 527-2/1A
Tensile Modulus 1.95 GPa283 ksi1mm/min; ISO 527-2/1A
Flexural Modulus 1.85 GPa268 ksiISO 178
Charpy Impact Unnotched NBNBISO 179/1eU
 20.0 J/cm²
@Temperature -30.0 °C
95.2 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eU
Charpy Impact, Notched 1.50 J/cm²7.14 ft-lb/in²ISO 179/1eA
 0.900 J/cm²
@Temperature -30.0 °C
4.28 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eA
Tensile Creep Modulus, 1 hour 1700 MPa247000 psiISO 899-1
Tensile Creep Modulus, 1000 hours 950 MPa138000 psiISO 899-1
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+11 ohm-cm1.00e+11 ohm-cmIEC 60093
Surface Resistance 1.00e+13 ohm1.00e+13 ohmIEC 60093
Dielectric Constant  3.8
@Frequency 1e+6 Hz
3.8
@Frequency 1e+6 Hz
IEC 60250
 3.8
@Frequency 100 Hz
3.8
@Frequency 100 Hz
IEC 60250
Dissipation Factor  0.0030
@Frequency 100 Hz
0.0030
@Frequency 100 Hz
IEC 60250
 0.0060
@Frequency 1e+6 Hz
0.0060
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 600 V600 VIEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 120 µm/m-°C66.7 µin/in-°FISO 11359-2
Melting Point 166 °C331 °FISO 11357-1,-2,-3
Deflection Temperature at 1.8 MPa (264 psi) 75.0 °C167 °FISO 75-1, -2
Vicat Softening Point 130 °C266 °FB50 (50°C/h 50N); ISO 306
 
Processing PropertiesMetricEnglishComments
Processing Temperature 20.0 - 30.0 °C68.0 - 86.0 °Fhopper
 60.0 - 80.0 °C140 - 176 °Fcavity
Feed Temperature 60.0 - 80.0 °C140 - 176 °F
Zone 1 170 - 180 °C338 - 356 °F
Zone 2 180 - 190 °C356 - 374 °F
Zone 3 190 - 200 °C374 - 392 °F
Zone 4 190 - 200 °C374 - 392 °F
Die Temperature 190 - 200 °C374 - 392 °F
Melt Temperature 190 - 200 °C374 - 392 °F
Drying Temperature 100 - 120 °C212 - 248 °F
Dry Time 3 - 4 hour3 - 4 hour
Moisture Content 0.15 %0.15 %Necessary low maximum
Injection Pressure 60.0 - 120 MPa8700 - 17400 psi
Hold Pressure 60.0 - 120 MPa8700 - 17400 psi
Back Pressure <= 2.00 MPa<= 290 psi
Screw Speed  70 rpm
@Diameter 55.0 mm
70 rpm
@Diameter 2.17 in
 100 rpm
@Diameter 40.0 mm
100 rpm
@Diameter 1.57 in
 150 rpm
@Diameter 25.0 mm
150 rpm
@Diameter 0.984 in
Hot-Working Temperature 190 - 200 °C374 - 392 °F
 
Descriptive Properties
Injection moldingYes
Injection speedslow-medium
Melt volume rate (MVR), cm³/10min4
MVR test load, kg2.16
MVR test temperature, °C190
Processing conditions acc. ISO9988-2

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