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Chemically Resistant adhesives

Cosmic Plastics FARBOSET® 2461 All Colors Mineral Filled Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled

Material Notes: Cosmic FARBOSET 2461 Black is a mineral-filled epoxy molding compound featuring fast cure rates, superb moldability, excellent thermal shock and moisture resistance. This compound was especially formulated to achieve a high glass transition temperature for optimum reliability performance in very thin sections. It is designed to encapsulate a wide range of devices including capacitors, resistors, and inductor coils.

Information provided by Cosmic Plastics Inc

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.88 g/cc1.88 g/cc
Bulk Density 0.900 g/cc0.0325 lb/in³powder
Density 2.08 g/cc0.0751 lb/in³Molded
Linear Mold Shrinkage 0.0040 cm/cm0.0040 in/in
Spiral Flow 76.0 cm29.9 inEMMI 1-66A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 56.5 MPa8200 psi
Flexural Strength 85.5 MPa12400 psi
Flexural Modulus 13.4 GPa1950 ksi
Compressive Strength 236 MPa34200 psi
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.20e+15 ohm-cm2.20e+15 ohm-cm
Surface Resistance >= 1.50e+15 ohm>= 1.50e+15 ohm
Dielectric Constant 5.12
@Frequency 1000 Hz
5.12
@Frequency 1000 Hz
Dielectric Strength 15.2 kV/mm
@Thickness 6.35 mm
387 kV/in
@Thickness 0.250 in
Dissipation Factor 0.012
@Frequency 1000 Hz
0.012
@Frequency 1000 Hz
Arc Resistance 194 sec194 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 27.0 µm/m-°C15.0 µin/in-°FAlpha 1
 60.0 µm/m-°C33.3 µin/in-°FAlpha 2
Thermal Conductivity 0.962 W/m-K6.67 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 163 °C325 °F
Flammability, UL94 V-0
@Thickness 3.17 mm
V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 145 - 180 °C293 - 356 °F
Cure Time  0.517 min
@Temperature 150 °C
0.00861 hour
@Temperature 302 °F
Hot Plate
 1.00 - 2.00 min
@Temperature 150 °C
0.0167 - 0.0333 hour
@Temperature 302 °F
 240 min
@Temperature 150 °C
4.00 hour
@Temperature 302 °F
Post cure
Shelf Life  0.0670 Month
@Temperature 35.0 °C
0.0670 Month
@Temperature 95.0 °F
2 days
 0.250 Month
@Temperature 25.0 °C
0.250 Month
@Temperature 77.0 °F
1 week
 12.0 Month
@Temperature 4.00 °C
12.0 Month
@Temperature 39.2 °F
 
Descriptive Properties
Molding Pressure200-1000 psi

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PCOSM029 / 190811

Chemically Resistant adhesives

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