Product Highlights:- Excellent heat transfer efficiency
- Low coefficient of thermal expansion (CTE)
- Superb mechanical strength properties
- Microns thin bond lines achievable
- Phenomenal electrical insulation properties
- Unlimited working life at room temperature
Kohesi Bond KB 1458 TC is a two component, thermal management epoxy system. This product offers high heat transfer capabilities. This product has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 - 40 × 10-6 m2•K/W. Since KB 1458 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 × 10-6 m2•K/W. KB 1458 TC has a wide service temperature range of -70°C to +150°C. It adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties and very low shrinkage upon cure. It offers excellent dimensional stability and a very low coefficient of thermal expansion (CTE). Part A and Part B are gray in color. Owing to its sensational thermal management properties KB 1458 TC is widely used in electronics, optical and specialty OEM industries. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
