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Chemically Resistant adhesives

Rogers Corporation RO4003C Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil
Categories: Ceramic; Ceramic Matrix Composite

Material Notes: RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for performance sensitive, high volume commercial applications. RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes.

Features and Benefits:

  • Glass-reinforced hydrocarbon and ceramic dielectric
  • Volume manufacturing process
  • Excellent high-frequency performance
  • Low Z-axis expansion, excellent dimensional stability
  • Integrated thin film resistor benefits
  • Foils available in 25, 50 and 100 OPS NiCr
  • Foils offered in 1/2 ounce copper weight
  • Lead-Free process compatible

Typical Applications:

  • Global communications systems
  • High reliability and complex multilayer circuits
  • Wireless communication devices

Information provided by Rogers Corporation.

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Physical PropertiesMetricEnglishComments
Density 1.79 g/cc0.0647 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.060 %
@Temperature 50.0 °C,
Time 173000 sec
0.060 %
@Temperature 122 °F,
Time 48.0 hour
Immersion; 0.06 in thick; ASTM D570
Thickness 203 - 1520 microns8.00 - 60.0 milRange of Thicknesses Available
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 141 MPa20400 psiRT, Y direction; ASTM D638
Tensile Modulus 26.9 GPa3900 ksiRT, Y direction; ASTM D638
Flexural Strength 276 MPa40000 psiIPC-TM-650, 2.4.4
Peel Strength 1.05 kN/m6.00 pliCopper, After Solder Float, 1/2 ounce TCR Foil; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.70e+16 ohm-cm1.70e+16 ohm-cmCond. A; IPC 2.5.17.1
Surface Resistance 4.20e+15 ohm4.20e+15 ohmCond. A; IPC 2.5.17.1
Dielectric Constant 3.553.55Design Spec., FSR, Z-direction; IPC-TM-650 2.5.5.6
 3.33 - 3.43
@Frequency 1e+10 Hz
3.33 - 3.43
@Frequency 1e+10 Hz
Process, Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5
Dielectric Strength 30.7 kV/mm
@Thickness 0.510 mm
780 kV/in
@Thickness 0.0201 in
Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor  0.0021
@Frequency 2.50e+9 Hz
0.0021
@Frequency 2.50e+9 Hz
IPC-TM-650 2.5.5.5
 0.0027
@Frequency 1e+10 Hz
0.0027
@Frequency 1e+10 Hz
IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  11.0 µm/m-°C
@Temperature -55.0 - 288 °C
6.11 µin/in-°F
@Temperature -67.0 - 550 °F
X-Direction; IPC-TM-650 2.4.41
 14.0 µm/m-°C
@Temperature -55.0 - 288 °C
7.78 µin/in-°F
@Temperature -67.0 - 550 °F
Y-Direction; IPC-TM-650 2.4.41
 46.0 µm/m-°C
@Temperature -55.0 - 288 °C
25.6 µin/in-°F
@Temperature -67.0 - 550 °F
Z-Direction; IPC-TM-650 2.4.41
Thermal Conductivity 0.710 W/m-K
@Temperature 80.0 °C
4.93 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Glass Transition Temp, Tg >= 280 °C>= 536 °FCondition A; IPC-TM-650 2.4.24
Decomposition Temperature 425 °C797 °FTGA; ASTM D3850
 
Descriptive Properties
Dimensional Stability< 0.3 mm/mX, Y direction; IPC-TM-650, 2.4.39A; after etch; +E2/150°C
Thermal Coefficient of Dielectric Constant40 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C; Z-Direction

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PROGA954 / 138394

Chemically Resistant adhesives

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