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Chemically Resistant adhesives

Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled; Filled/Reinforced Thermoset

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconductor devices including diodes, transistors, and integrated circuits in dual in-line, quad or small outline configurations.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.80 g/cc0.0650 lb/in³
Spiral Flow 64.0 - 88.0 cm25.2 - 34.6 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Tensile Strength, Ultimate 97.0 MPa14100 psi
Flexural Strength 147 MPa21300 psi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.9
@Frequency 1000 Hz
3.9
@Frequency 1000 Hz
Dielectric Strength 20.0 kV/mm508 kV/in
Dissipation Factor 0.0060
@Frequency 1000 Hz
0.0060
@Frequency 1000 Hz
Arc Resistance 190 sec190 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 22.0 µm/m-°C
@Temperature 20.0 °C
12.2 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 78.0 µm/m-°C
@Temperature 20.0 °C
43.3 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.600 W/m-K4.16 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C311 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 175 - 185 °C347 - 365 °FMolding temperature

**
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PCOOK302 / 21398

Chemically Resistant adhesives

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