Emerson & Cuming 281 Eccobond® One-Component Thermally Conductive Epoxy Adhesive Highly filled, thermally conductive, thixotropic, epoxy adhesive. Good thermal shock, electrical insulation and chemical resistance properties. Low coefficient of expansion. Recommended for bonding metals and ceramics in heat sink applications. Cure Type: Heat Bonding Type: Epoxy The Eccobond® product line is now a part of Henkel; this specific grade is discontinued. |