Product Highlights:- Superior thermal conductivity > 7 W/m/K
- Excellent chemical resistance
- Superb mechanical strength properties
- Good flow properties
- Easy to use mix ratio of 100:10 by weight
- Very good dimensional stability
Kohesi Bond KB 1041 AN is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:10 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 offers first-rate thermal conductivity (> 7 W/m/K), ideal for heat sink bonding. It has a smooth glossy appearance upon cure. It offers an extensive service temperature range of -50°C to +150°C. This adhesive fosters outstanding mechanical strength properties, especially under tensile and compression. It offers minimal shrinkage upon cure and cures rigid. In addition to a long working life, it also offers good chemical resistance to a variety of fuels, oils, acids, bases and boiling water. Part A is gray in color and Part B light yellow - clear in color. KB 1041 AN is widely used in optical, aerospace, electronics, specialty OEM and related industries. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
