Lord Adhesives Circalok™ 6703A/B Thermally Conductive Two Part Silicone, Flame Retardant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Lord Adhesives Circalok™ 6703A/B Thermally Conductive Two Part Silicone, Flame Retardant
Categories:	Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade
Material Notes:	Circalok™ 6703 A/B is a low viscosity, high density, thermally conductive, two part silicone. Circalok™ 6703 A/B is an ideal material for potting or encapsulating densely packed power units requiring a thermal transfer. Its low viscosity permits easy use for high density population electronics while assuring very good thermal properties. Circalok™ 6703 A/B is a flame retardant system and is certified to UL94V-O. All information provided by Lord.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.91 g/cc	1.91 g/cc	Hardener
	2.00 g/cc	2.00 g/cc	Mixed
	2.09 g/cc	2.09 g/cc	Resin
Viscosity	5500 cP @Temperature 25.0 °C	5500 cP @Temperature 77.0 °F	Part B
	8000 cP @Temperature 25.0 °C	8000 cP @Temperature 77.0 °F	Mixed
	13500 cP @Temperature 25.0 °C	13500 cP @Temperature 77.0 °F	Part A
Linear Mold Shrinkage	0.0030 cm/cm	0.0030 in/in

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	60	60
Tensile Strength, Yield	1.38 MPa	200 psi
Elongation at Yield	80 %	80 %
Tear Strength	10.5 kN/m	60.0 pli	Die B

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm	1.00e+14 ohm-cm
Dielectric Constant	4.25 @Frequency 1e+6 Hz, Temperature 25.0 °C	4.25 @Frequency 1e+6 Hz, Temperature 77.0 °F
Dielectric Strength	19.7 kV/mm	500 kV/in
Dissipation Factor	0.020 @Frequency 1e+6 Hz, Temperature 25.0 °C	0.020 @Frequency 1e+6 Hz, Temperature 77.0 °F

Thermal Properties	Metric	English	Comments
CTE, linear	2.20 µm/m-°C	1.22 µin/in-°F
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	Mathis Hot Disc Transient Method
Maximum Service Temperature, Air	200 °C	392 °F
Flammability, UL94	V-0	V-0

Processing Properties	Metric	English	Comments
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Pot Life	60 - 120 min @Temperature 25.0 °C	60 - 120 min @Temperature 77.0 °F
Shelf Life	9.00 Month @Temperature 25.0 °C	9.00 Month @Temperature 77.0 °F	Part A
	9.00 Month @Temperature 25.0 °C	9.00 Month @Temperature 77.0 °F	Part B

Descriptive Properties
Appearance	Black		Part A
	Dark Gray		Mixed
	White		Part B
Mix Ratio	100:100		by weight
	100:109.4		by volume

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Lord Adhesives Thermoset™ SC-102 Unfilled Silicone Encapsulant
Lord Adhesives Thermoset™ SC-300M Silicone Gel Encapsulant
Lord Adhesives CoolTherm™ SC-252 Silicone encapsulant system
Lord Adhesives CoolTherm™ SC-104 Thermally Conductive Silicone Encapsulant
Lord Adhesives Circalok™ 6715 Silicone Encapsulant

PLORD061 / 86069

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message