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Ensinger PEI

Henkel Loctite® 3143 Deep Potting Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced; Epoxy, Thermally Conductive

Material Notes:
Potters
Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3143 Deep Potting Epoxy
A heat cure soft epoxy for deep potting applications that require low shrinkage, thermal stability and environmental resistance. Cure Type: Heat Bonding Type: 2 part epoxy

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Physical PropertiesMetricEnglishComments
Viscosity 1800 cP1800 cPMixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 1515
Hardness, Shore OO 6464
 
Thermal PropertiesMetricEnglishComments
CTE, linear 70.0 µm/m-°C
@Temperature 20.0 °C
38.9 µin/in-°F
@Temperature 68.0 °F
Glass Transition Temp, Tg -27.0 °C-16.6 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 180 min
@Temperature 80.0 °C
3.00 hour
@Temperature 176 °F
Pot Life 30.0 min
@Temperature 80.0 °C
30.0 min
@Temperature 176 °F
Gel Time 90.0 min90.0 minat 80°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PLOCT194 / 51930

Proto3000 – 3D Engineering Solutions

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