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Chemically Resistant adhesives

Arlon Electronic Materials 91ML Low-Cost Halogen-Free Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Thermally conductive, multilayerable laminate and prepreg circuit board material. Available in various resin content percentages.

Arlon 91ML ceramic filled thermally conductive multifunctional epoxy laminate and prepreg products provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics for multilayer PWBs for applications requiring thermal management throughout the entire board volume.

  • Engineered for use with metal backing for producing Metal-Clad PCBs
  • RoHS/WEEE compliant

Typical Applications:

  • High brightness LEDs
  • DC-DC power converters
  • Automotive electronics
  • Electronic designs with limited thermal management alternatives

Information provided by ARLON Electronic Materials.

Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesMetricEnglishComments
Density 2.05 g/cc0.0741 lb/in³ASTM D792 Method A
Water Absorption 0.13 %0.13 %IPC TM-650 2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Flexural Strength 214 - 338 MPa31000 - 49000 psiIPC TM-650 2.4.4
Peel Strength 0.789 kN/m4.50 pliTo Copper (1 oz/35 micron); After Process Solutions; IPC TM-650 2.4.8
 0.877 kN/m5.00 pliTo Copper (1 oz/35 micron); After Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.20e+13 ohm-cm1.20e+13 ohm-cmE24/125; IPC TM-650 2.5.17.1
 2.80e+14 ohm-cm2.80e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 1.70e+13 ohm1.70e+13 ohmE24/125; IPC TM-650 2.5.17.1
 4.40e+13 ohm4.40e+13 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 5.5
@Frequency 1e+6 Hz
5.5
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
Dielectric Strength >= 39.4 kV/mm>= 1000 kV/inIPC TM-650 2.5.6.2
Dielectric Breakdown 43000 V43000 VIPC TM-650 2.5.6
Dissipation Factor 0.017
@Frequency 1e+6 Hz
0.017
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 193 sec193 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 23.0 µm/m-°C12.8 µin/in-°Fx,y direction; IPC TM-650 2.4.41
CTE, linear, Transverse to Flow  36.0 µm/m-°C
@Temperature <=160 °C
20.0 µin/in-°F
@Temperature <=320 °F
z (< Tg); IPC TM-650 2.4.24
 192 µm/m-°C
@Temperature >=160 °C
107 µin/in-°F
@Temperature >=320 °F
z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity 1.00 W/m-K6.94 BTU-in/hr-ft²-°FZ-axis; ASTM E1461
 1.90 W/m-K13.2 BTU-in/hr-ft²-°FX/Y-axis; ASTM E1461
Glass Transition Temp, Tg 160 °C320 °FTMA; IPC TM-650 2.4.24
 170 °C338 °FDSC; IPC TM-650 2.4.25
Decomposition Temperature 354 °C669 °FOnset; IPC TM-650 2.3.41
 368 °C694 °F5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-0V-0
 
Descriptive Properties
Dielectric Withstand Voltage (VDC)> 5000HiPot; IPC TM-650 2.5.7.2
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 30IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 10IPC TM-650 2.4.24.1
Z-Axis Expansion (%)2.6IPC TM-650 2.4.24 (50-260°C)

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Chemically Resistant adhesives

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