Product Highlights:- Superior thermal conductivity
- Very low coefficient of thermal expansion
- Excellent dimensional stability
- Excellent flow properties
- Outstanding electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. It offers stellar thermal conductivity and is capable of passing NASA low outgassing test. Its stellar heat transfer capabilities and flow characteristics make it fitting for potting applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 AN-1 can withstand severe thermal cycling and provides superior physical strength properties and dimensional stability. It offers an extensive service temperature range of -50°C to +120°C. KB 1040 AN-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It offers chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has a clear color. Owing to its excellent performance and vacuum compatibility KB 1040 AN-1 is widely used in aerospace, electronics and related industries. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
