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solder replacement adhesives

Lucas-Milhaupt FOS FLO 670 Copper Phosphorus Tin Braze Filler Metal
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes:

Applications:Fos-Flo 7 iFos-Flo 670 is a low cost brazing filler metal suitable for joining copper to copper and copper to copper alloys where critical impact or vibration stresses are not encountered in service. It should only be used on assemblies where good fitup can be maintained.

Characteristics: Fos-Flo 670 is a copper rich, low temperature, brazing filler metal that is free flowing and self-fluxing on copper by virtue of its phosphorus content. This alloy is extremely fluid when heated rapidly to its flow point and will penetrate joints with very little clearance. Best results are obtained with joint clearances of .001-.003 in. (.025 mm - .075 mm).

The self-fluxing property of Flo 670 is effective on copper only. Copper base alloys, such as brass or bronze, may be brazed with Fos Flo 670 if the joints are coated with Handy Flux. Fos Flo 670 should not be used on ferrous metals or nickel base alloys, since the phosphorus produces brittle iron or nickel phosphides at the joint interface.

Information provided by Lucas-Milhaupt, Inc.

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Thermal PropertiesMetricEnglishComments
Melting Point 657.2 - 688 °C1215 - 1270 °F
Solidus 657.2 °C1215 °FMelting Point
Liquidus 688 °C1270 °FFlow Point
 
Processing PropertiesMetricEnglishComments
Processing Temperature 688 - 788 °C1270 - 1450 °FBrazing Range
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu >= 86.25 %>= 86.25 %
Other, total <= 0.15 %<= 0.15 %
Phosphorus, P 6.0 - 6.4 %6.0 - 6.4 %
Tin, Sn 6.7 - 7.2 %6.7 - 7.2 %
 
Descriptive Properties
ColorLight Brown

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NLUCMI12 / 18079

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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