Arlon Electronic Materials 51N Lead-Free Compatible Epoxy Low-Flow

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Arlon Electronic Materials 51N Lead-Free Compatible Epoxy Low-Flow
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required. Decomposition Temperature > 350°C is ideally suited for lead-free solder processing and offers significant improvement over traditional FR-4 Epoxy systems. Multifunctional epoxy resin system with a Glass transition temperature of 170°C thermal cycling PTH reliability Improved bond adhesion over multiple thermal excursions results in better reliability through reflow and rework operations. Electrical and mechanical properties meet the flow requirements of IPC-4101B/124 prepreg, modified to be low-flow. Compatible with lead-free solder processing RoHS/WEEE compliant Typical Applications: Bonding multilayer rigid-flex boards Attaching heat sinks to finished PCB assemblies Dielectric insulators Other applications where minimal and uniform resin flow is required Information provided by ARLON Electronic Materials.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Metric	English	Comments

Density	1.35 g/cc	0.0488 lb/in³	ASTM D792 Method A
Water Absorption	0.15 %	0.15 %	IPC TM-650 2.6.2.1

Mechanical Properties	Metric	English	Comments
Tensile Strength	44.8 MPa	6500 psi	IPC TM-650 2.4.18.3
Modulus of Elasticity	17.9 GPa	2600 ksi	IPC TM-650 2.4.18.3
Flexural Strength	579 MPa	84000 psi	IPC TM-650 2.4.4
Peel Strength	1.12 kN/m	6.40 pli	To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
	1.17 kN/m	6.70 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
	1.17 kN/m	6.70 pli	To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.60e+13 ohm-cm	2.60e+13 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
	3.30e+13 ohm-cm	3.30e+13 ohm-cm	E24/125; IPC TM-650 2.5.17.1
Surface Resistance	4.00e+12 ohm	4.00e+12 ohm	E24/125; IPC TM-650 2.5.17.1
	2.90e+13 ohm	2.90e+13 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	4.1 @Frequency 1e+9 Hz	4.1 @Frequency 1e+9 Hz	may vary with resin %; IPC TM-650 2.5.5.9
	4.2 @Frequency 1e+6 Hz	4.2 @Frequency 1e+6 Hz	may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength	39.4 kV/mm	1000 kV/in	IPC TM-650 2.5.6.2
Dissipation Factor	0.020 @Frequency 1e+6 Hz	0.020 @Frequency 1e+6 Hz	IPC TM-650 2.5.5.3
	0.020 @Frequency 1e+9 Hz	0.020 @Frequency 1e+9 Hz	IPC TM-650 2.5.5.9
Arc Resistance	>= 120 sec	>= 120 sec	IPC TM-650 2.5.1

Thermal Properties	Metric	English	Comments
CTE, linear	14.0 µm/m-°C	7.78 µin/in-°F	IPC TM-650 2.4.41
CTE, linear, Transverse to Flow	44.0 µm/m-°C	24.4 µin/in-°F	z, below Tg; IPC TM-650 2.4.24
	245 µm/m-°C	136 µin/in-°F	z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity	0.250 W/m-K	1.74 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	166 °C	331 °F	TMA; IPC TM-650 2.4.24
	170 °C	338 °F	DSC; IPC TM-650 2.4.25
Decomposition Temperature	354 °C	669 °F	Onset; IPC TM-650 2.4.24.6
	368 °C	694 °F	5 percent; IPC TM-650 2.4.24.6
Flammability, UL94	V-0	V-0

Descriptive Properties
IPC Delamination - T260 (minutes)	> 60		IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)	> 30		IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)	15		IPC TM-650 2.4.24.1
Z-Axis Expansion (%)	2.6		IPC TM-650 2.4.24 (50-260°C)

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