Lord Adhesives CoolTherm™ SC-324 XLW Thermally Conductive Silicone Encapsulant

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Lord Adhesives CoolTherm™ SC-324 XLW Thermally Conductive Silicone Encapsulant
Categories:	Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade
Material Notes:	LORD CoolTherm™ SC-324 XLW thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. Features: exhibits low shrinkage and stress on components as it cures. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials. provides excellent thermal shock resistance and flame retardancy. All information provided by Lord.
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Physical Properties	Metric	English	Comments

Specific Gravity	3.20 g/cc	3.20 g/cc	All components
Water Absorption	<= 0.10 %	<= 0.10 %	cured; ASTM D 570-81
Viscosity	24000 cP @Temperature 25.0 °C	24000 cP @Temperature 77.0 °F	SC-324 XLW Hardener
	27000 cP @Temperature 25.0 °C	27000 cP @Temperature 77.0 °F	mixed
	35000 cP @Temperature 25.0 °C	35000 cP @Temperature 77.0 °F	SC-324 XLW Resin

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	<= 10 ppm	<= 10 ppm	cured
Ionic Impurities - K (Potassium)	<= 10 ppm	<= 10 ppm	cured
Ionic Impurities - Cl (Chloride)	<= 10 ppm	<= 10 ppm	cured

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	20	20	cured; ASTM D 2240
Tensile Strength	0.310 MPa @Temperature 25.0 °C	45.0 psi @Temperature 77.0 °F	cured; ASTM D 412
Elongation at Break	15 %	15 %	ASTM D 412

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 2.00e+13 ohm-cm @Temperature 25.0 °C	>= 2.00e+13 ohm-cm @Temperature 77.0 °F	cured; ASTM D 257
Dielectric Strength	7.40 kV/mm	188 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	65.0 µm/m-°C	36.1 µin/in-°F	ASTM D 2240
Thermal Conductivity	4.00 W/m-K	27.8 BTU-in/hr-ft²-°F	Hot Disc Transient Method, cured

Processing Properties	Metric	English	Comments
Working Life	360 min @Temperature 25.0 °C	360 min @Temperature 77.0 °F	Mixed
Shelf Life	3.00 Month @Temperature 25.0 °C	3.00 Month @Temperature 77.0 °F	SC-324 XLW Hardener
	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F	SC-324 XLW Resin

Descriptive Properties
Appearance	Light Pink Liquid		Mixed
	Pink Liquid		SC-324 XLW Resin
	White Liquid		SC-324 XLW Hardener
Extractable Ionic Contaminants	10 ppm max		Ammonium
	10 ppm max		Bromide
	10 ppm max		Sulfate

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PLORD9306 / 232662

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