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solder replacement adhesives

Lucas-Milhaupt Silvaloy® X55 Brazing Alloy
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes: Silvaloy X55 has excellent gap filling capability and plasticity when in the molten condition. It also exhibits excellent strength and ductility while cooling from the liquid stage. The improved strength and ductility at elevated temperatures gives it the added advantage over nickel silvers in joining materials with dissimilar coefficient of expansion.

The primary application is in the joining of carbides to steel holders. This application requires an alloy with good gap filling characteristics as well as superior toughness and ductility at elevated temperatures.

Information provided by Lucas-Milhaupt Warwick, LLC (formerly Wolverine Joining Technologies).

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 8.35 g/cc8.35 g/cc
Density 8.33 g/cc0.301 lb/in³
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000160 ohm-cm0.0000160 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Melting Point 866 - 885.0 °C1590 - 1625 °F
Solidus 866 °C1590 °F
Liquidus 885.0 °C1625 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 899 - 1010 °C1650 - 1850 °FBrazing Temperature
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 54 - 56 %54 - 56 %
Manganese, Mn 3.25 - 4.75 %3.25 - 4.75 %
Nickel, Ni 5.25 - 6.75 %5.25 - 6.75 %
Zinc, Zn 32.5 - 37.5 %32.5 - 37.5 %As balance
 
Descriptive Properties
ColorLight Yellow
Electrical Conductivity (% IACS)10.8

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NBRW042 / 79818

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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