Applications: Bynel® Series 4200 resins are specifically designed to provide high interlayer adhesion between EVOH, polyamide, PE, ethylene copolymers, and ionomers. Applications in which the use of these resins is advantageous include: barrier bag-in-box films; large pouches for hospital, restaurant, or institutional uses; rigid containers in which PE is the structural component. In addition, with their high adhesion to ionomers, these resins are advantageous in multilayer ionomer/barrier constructions designed to package oily products. Bynel® 4208, with its low melt index, is particularly useful where better bubble stability in the blown film process or less parison sag in coextrusion blow molding is desirable. Bynel® 4288 is specifically designed for high bonding performance with EVOH in high-speed coextrusion coating or laminating applications. It can also be used in cast film applications.

Physical properties of Bynel® Series 4200 resins are typical of low-density polyethylene resins with similar density and melt index values. The rheology characteristics of each grade are different, so one may be better suited than the others to a particular extrusion process.

Information provided by DuPont Packaging Polymers.

This former DuPont product line is now a Dow product line.